Thermal conductive filler
Technical documents
Product Introduction
The powder has been surface treated with special additives and has good compatibility with the resin;
Lower viscosity and higher fluidity make it easier to process;
Compared with other thermal conductive fillers, low filling can achieve high thermal conductivity;
Easy and convenient to use, it can be directly mixed with the base adhesive according to the recommended formula.
Lower viscosity and higher fluidity make it easier to process;
Compared with other thermal conductive fillers, low filling can achieve high thermal conductivity;
Easy and convenient to use, it can be directly mixed with the base adhesive according to the recommended formula.
Product Details
|
Brand |
Appearance | whiteness % |
DBP g/100g |
Application Scenarios |
| C-F61501 |
White Powder |
≥82 |
10-18 | 1.5W Silicone Potting Compound |
|
C-S62001 |
White Powder |
≥78 |
10-16 |
2.0W Silicone Potting Compound |
| C-S66001 |
White Powder |
≥70 | 5-12 |
6.0W Silicone Potting Compound |